HTE LABS
THIN FILMS CAPABILITIES
|
RESISTIVE FILMS |
High stability, Laser trim able,
Low TCR |
NiCr |
5, 10, 25,...200, 300, 400 ohms/sq,
+/-10 to +/-100ppm/degC |
TaN2 |
25,50,500,1000, to 2500 ohms/sq,
+/-5 to +/-150ppm/degC |
SiCr |
0.5K, 1K, 2.5K, 5K, 10k, 20K ohms/sq,
+/-10 to +/-200ppm/degC |
DIFFUSION BARRIER METALS |
Ni, Mo, Pt, Pd, Ta, Ti, TiW, TiNx,
TiW:Nx..... |
ADHESION LAYERS |
Cr, Mo, Ni, NiCr, Si, Ti, TiW,
TiNx.... |
CONDUCTIVE LAYERS |
Al, Au, beta-Ta, Cu, Ni, Sn, SnPb,
Zr... |
NITRIDE AND OXIDE FILMS |
AlN, Fe2O3, Si3N4 |