HteLabs - WAFER FOUNDRY

WAFER FOUNDRY
GOLD or COPPER INTERCONNECTIONS ONLY

HTE Labs's WAFER FOUNDRY OPERATION develops custom technologies and builds prototypes of discrete and integrated circuits. Most standard processes are designed for small wafer volumes of BIPOLAR, CMOS, and BICMOS technologies for linear applications.

The technologies developed are generally compatible with the processes of major wafer foundry suppliers. A major difference exist however in the use of GOLD and COPPER Interconnections instead of Aluminum. A proprietary Thin Film Resistors (TFR) process has been developed for all technologies providing stable, low TCR, laser trimmable resistors that provides linear circuit designers with an increased flexibility.

HTE Labs engineers work closely with customers to assure that well-defined design rules tailored to our technologies are followed and that silicon processing procedures are well understood. Upon completion of a custom developed technology, HTE Labs provides customers with a set of SPICE parameters and layout design rules and a library of standard devices.

The following is a listing of available processes as well as processes currently in development:

20V Bipolar process
45V Bipolar process
75V Bipolar process
25V Superbeta Bipolar process
High Voltage Dielectic Isolated Bipolar process

BIPOLAR 20V, 500MHz + Thin Film Resistors	Completed
BIPOLAR 20V, 3.5G Complimentary + Thin Film Resistors	Development
BIPOLAR 25V, 200 MHz Super Beta (HFE>000)	Completed
BIPOLAR 45V 200 MHz + Thin Film Resistors	Completed
BIPOLAR 75V, 200 MHz HFE = 250	Completed
BICMOS: Double Layer Refractory Silicide15V – 25V, 7.5G NPN Complimentary + Thin Film Resistors	Development
CMOS: Double Layer Refractory Silicide, Double metal + Thin Film Resistors	Development

HTE Labs provides customers with high quality process development services and a fast turn around at competitive prices.

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